印制电路用电解铜箔 ED Copper Foil for Printed Circuit Board

        公司可提供1/3OZ-3OZ（名义厚度12um-105um）的低轮廓（L）高温延展性（HTE）铜箔特性，产品幅宽250mm-1340mm,产品质量达到IPC4562-2000标准II、III级要求，具有优异的常温储存性能、高温抗氧化性能、优良的高温延伸性能，适用于各类树脂体系的双面、多层印制线路板。公司亦可提供低轮廓（LP）、甚低轮廓（VLP）的高温延展性电解铜箔（HTE）。

    We provide the 1/3oz/ft² to 3oz/ ft² (nominal thickness 12 µ m to 105 µ m ) high temperature elongation (THE) ED copper foils,the widths are from 250-1340 mm,and the quality reaches the II and III requirements of the international standard IPC-4562,these products have the perfect normal temperature storage performance,the high temperature anti-oxidization performance,and high temperature elongation performance,and can be used in the production of the different double-face and multi-layer printed boards.We can also provide low-profile（LV）and very low-profile (VIP) THE ED copper foils.

低轮廓（L）高温延展性（HTE）铜箔特性

注：1、铜箔毛面RZ值为HR测试稳定值，不作保证值。

        2、剥离强度为标准FR-4板测试值。（140℃/5张7628PP）

        3、品质保证期限自收货日起90天。

Note: 1、The Rz value of the surface roughness is the tested stable value,not the guarantee value.

         2、The peel strength is the test value of the standard FR-4 plate.( 140℃ 5 pieces of the 7628PP)

         3、The duration of the quality guarantee period is 90 days from the receiving date.